Circuiti stampati

"Excellence is not an act but a habit."

Aristoteles

 
 
 
Our Production Process is extremely competitive, technological and up-to-date. We can produce more than 40 milion PCBs per year. The important investments that we have been carrying out in the course of the years have let improve our production capability in terms of quality, speed and reliability.
 
 
In this section you can find an indicative list of the capability of Piciesse products.
 
Piciesse Electronics is always at your personal disposal for any request, information or doubt.
 
Flex aluminium   >

Capacity

Standard production

Advanced production

Layer Count / Technology

Single-face flexible

Single-face flexible

Circuit thickness

1 – 1.5 - 2.0 – 3.0 mm

1 – 1.5 – 2.0 - 3.0 mm

Materials

Dielectric thickness from 25μm to 35μm

Dielectric thickness from 25μm to 35μm

Copper thickness

18μm / 35μm/ 70μm /105μm

18μm / 35μm/ 70μm /105μm/210μm

Min. conductor / insulation

0.25 mm* (reference parameter:  35μm copper)

0.1 mm* (reference parameter:  35μm copper)

Solder resist alignment

+/- 150μm (screen print)

+/- 76μm (photo print)

Min. solder resist section

200μm

150μm

Solder resist colours

green / white / black / red / blue/grey

green / white / black / red / blue/grey

Max. circuit size

580 mm x 470 mm

580 mm x 470 mm

Production panel

610 mm x 500 mm Personalised for optimal use

610 mm x 500 mm Personalised for optimal use

Min. Annular Ring

200μm

150μm

Minimum hole

1.5 mm

1.0 mm

Minimum milling

2 mm

2 mm

Finishes

Lead free Hal/ OSP / Sn chemical Ni/Au chemical / Ni/Pd/Au chemical

Lead free Hal/ OSP / Sn chemical Ni/Au chemical / Ni/Pd/Au chemical

Scoring

Yes

Yes

Die-cut holes and contours

Yes

Yes

Component screen printing

White / Black

White / Black

Bending angle

90°

60°

 

Single-sided circuits  >

Capacity

Standard production

Advanced production

No. layers/ Technology

Single-sided

Single-sided

Circuit thicknesses

0.8 - 1 - 1.2 – 1.6 – 3.2 - mm

0.5 – 1 – 1.2 – 1.6 – 2.4 – 3.2 mm

Materials

Standard Tg and CTI

Elevated Tg (170°C), elevated CTI (600)

Copper thickness

18μm / 35μm/ 70μm /105μm/210μm

18μm / 35μm/ 70μm /105μm/210μm/280μm/400

Min. conductor / insulation

0.25 mm* (reference parameter:  35μm copper)

0.1 mm* (reference parameter: 35μm copper)

Solder resist alignment

+/- 150μm (screen print)

+/- 76μm (photo print)

Min. solder resist section

200μm

150μm

Solder resist colours

green / white / black / red / blue/ grey

green / white / black / red / blue/ grey

Max. circuit size

580 mm x 470 mm

580 mm x 470 mm

Production panel

610 mm x 500 mm Personalised for optimal use

610 mm x 500 mm Personalised for optimal use

Min. Annular Ring

200μm

150μm

Minimum hole

1.5 mm

1.0 mm

Minimum milling

2 mm

2 mm

Finishes

Lead free Hal / Sn Pb Hal / OSP / Sn chemical Ni/Chemical Au / Ni/Pd/Chemical Au

Lead free Hal / Sn Pb Hal / OSP / Sn chemical Ni/Chemical Au / Ni/Pd/Chemical Au

Scoring

Yes

Yes

Die-cut holes and contours

Yes

Yes

Component screen printing

White / Black

White / Black

Graphite, silver and strippable material print

Yes

Yes

 

Aluminium  >

Capacity

Standard production

Advanced production

No. layers/Technology

single-face

single-face

Circuit thickness

1 – 1.5 - 2.0 – 3.0 mm

1 – 1.5 – 2.0 - 3.0 mm

Materials

dielectric on a prepreg base dielectric on a resin base

dielectric on a prepreg base dielectric on a resin base

Copper thickness

18μm / 35μm/ 70μm /105μm

18μm / 35μm/ 70μm /105μm/210 μm/400μm

Min. conductor / insulation

0.25 mm* (reference parameter:  35μm copper)

0.1 mm* (reference parameter:  35μm copper)

Solder resist alignment

+/- 150μm (screen print)

+/- 76μm (photo print)

Min. solder resist section

200μm

150μm

Solder resist colours

green / white / black / red / blue/grey

green / white / black / red / blue/grey

Max. circuit size

580 mm x 470 mm

580 mm x 470 mm

Production panel

610 mm x 500 mm Personalised for optimal use

610 mm x 500 mm Personalised for optimal use

Min. Annular Ring

200μm

150μm

Minimum hole

1.5 mm

1.0 mm

Minimum milling

2 mm

2 mm

Finishes

Lead free Hal/ OSP / Sn chemical Ni/Au chemical / Ni/Pd/Au chemical

Lead free Hal/ OSP / Sn chemical Ni/Au chemical / Ni/Pd/Au chemical

Scoring

Yes

Yes

Die-cut holes and contours

Yes

Yes

Component screen printing

White / Black

White / Black

Graphite, silver and strippable material print

Yes

Yes

 

Double-face circuits  >

Capacity

Standard production

Advanced production

No. layers/Technology

Single-face - 2 layers

Single-face – up to 6 layers

Circuit thickness

0.5 – 1.6 – 2.4 mm

0.1 – 1.6 -2.4 – 3.2 mm

Materials

FR4 / FR4 with reduced halogen content

FR4 / Teflon / Rogers

Tg

105°C / 140°C / 170°C

105°C / 140°C / 170°C

Copper thickness (base)

18μm / 35μm / 70μm / 105μm / 140 μm /210 μm

9μm / 18μm / 35μm / 70μm / 105μm / 140μm / 210 μm / 400 μm

Hole metallisation

20μm

25μm

Min. conductor / insulation

0.076 mm* (reference parameter:  35μm copper)

0.076 mm* (reference parameter:  35μm copper)

Solder resist alignment

+/- 100μm (photo print)

+/- 76μm ( photo print)

Min. solder resist section

150μm

100μm

Solder resist colours

green / white / black / red / blue/ grey

green / white / black / red / blue/ grey

Max. circuit size

580 mm x 500 mm

580 mm x 500 mm

Production panel

609.6 mm x 530 mm, 609.6 mm x 457.2 mm

609.6 mm x 530 mm, 609.6 mm x 457.2 mm

Min. Annular Ring

150μm

100μm

Minimum hole

0.2 mm

0.2 mm

Minimum milling

0.8 mm

0.6 mm

Finishes

OSP / Lead free Hal/ Sn chemical - Ni/Au chemical/Ag chemical - Ni/Electrolytic  Au /gold contacts

OSP / Lead free Hal/ Sn chemical - Ni/Au chemical/Ag chemical - Ni/Electrolytic Au /gold contacts

Scoring

Yes

Yes

Die-cut holes and contours

Yes

Yes

Component screen printing

White / Black

White / Black

 

Multi-layer circuits  >

Capacity

Standard production

Advanced production

No. layers/Technology

4 - 50 layers

4 - 50 layers

Circuit thickness

From 0.4 to 12 mm

From 0.32 to 12 mm

Materials

FR4 / FR4 with reduced halogen content

FR4 / Teflon / Rogers / others on request

Tg

105°C / 140°C / 170°C

105°C / 140°C / 170°C

Prepreg

106 / 1080 / 2116 / 1501 /7628

1037 / 106 / 1080 / 2116 / 1501 / 7628

Copper thickness (base)

18μm / 35μm / 70μm / 105μm

9μm / 18μm / 35μm / 70μm / 105μm / 140μm/210μm /280μm /350μm /400μm

Hole metallisation

20μm

25μm

Min. conductor / insulation

0.1 mm* (reference parameter:  35μm copper)

0.076 mm* (reference parameter:  35μm copper)

Solder resist alignment

+/- 100μm (photo print)

+/- 76μm (photo print)

Min. solder resist section

150μm

100μm

Solder resist colours

green / white / black / red / blue/ grey

green / white / black / red / blue/ grey

Max. circuit size

575 mm x 500 mm

575 mm x 500 mm

Production panel

609.6 mm x 530 mm, 609.6 mm x 457.2 mm

609.6 mm x 530 mm, 609.6 mm x 457.2 mm

Min. Annular Ring

150μm

100μm

Minimum hole

0.2 mm

0.1 mm

Minimum milling

0.8 mm

0.8 mm

Finishes

OSP / Lead free Hal/ Sn chemical - Ni/Au chemical/Ag chemical - Ni/Electrolytic Au /gold contacts

OSP / Lead free Hal/ Sn chemical - Ni/Au chemical/Ag chemical - Ni/Electrolytic Au /gold contacts

Scoring

Yes

Yes

 

Flex circuits  >

Capacity

Standard production

Advanced production

No. layers/Technology

Single-face, 2 layers

Single-face, up to 6 layers

Circuit thickness

75μm - 800μm (including contact supports)

50μm - 1200μm (including contact supports)

Materials

PET - Polyamide

Polyamide

Minimum thickness

50μm

25μm

Copper thickness (base)

9μm / 12μm / 18μm / 35μm /70μm

9μm / 12μm / 18μm / 35μm / 70μm

Hole metallisation

20μm

25μm

Min. conductor / insulation

0.125 mm* (reference parameter:  35μm copper)

0.065 mm* (reference parameter:  35μm copper)

Solder resist alignment

+/- 100μm (photo print)

+/- 50μm (photo print)

Min. solder resist section

100μm

65μm

Cover lay colours

amber

amber, white, yellow, clear

Contour

Cut, die-cut

Cut, die-cut

Production panel

609.6 mm x 457.2 mm 250 mm x (250 - 410 mm)

609.6 mm x 457.2 mm 250 mm x (250 - 410 mm)

Min. Annular Ring

150μm

150μm

Minimum hole

0.28 mm

0.2 mm

Minimum milling

0.8 mm

0.8 mm

Finishes

OSP / Lead free Hal/ Sn chemical - Ni/Au chemical/Ag chemical - Ni/Electrolytic Au

OSP / Lead free Hal/ Sn chemical - Ni/Au chemical/Ag chemical - Ni/Electrolytic Au

Adhesive

Yes

Yes

Component screen printing

White / Black

White / Black

 

 

 

We must respect our Environment, Health, Security and Morality. We have been always manufacturing our products according to these k-principles. Our approach is confirmed  by our certificates:

 

  1. We have been working in line with ISO TS16949 by extending its principles to Not-Automotive Products, as well;

  2. We have been working within a system ISO9001:2008/ ISO TS 16949:2009, OHSAS 18001:2007, ISO 14001:2004 certified and aimed to the progressive improvement;

  3. We are Certified Members in the EIPC (European Institute of Printed Circuits);

  4. We have been respecting RoHS2, Reach, Conflict Free, RAEE, WEEE Regulations;

  5. Our Products can be UL listed;

  6. We have the Product Liability Insurance and the Credit Insurance to better safeguard our Customers;

  7. We are Certified Members in the Platform LED LIGHT FOR YOU, powered by Osram. We are in the section “Thermal Solutions” for the Thermal Management through Substrates: https://www.ledlightforyou.com/Partners/en-PICIESSE-ELETTRONICA-SRL.html;

  8. We have the Legality Rating in line with law and the highest standards of ethical and social responsibility.

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Piciesse Elettronica s.r.l. – Printed Circuit Boards

Via Conca, 445 - 47854 Taverna di Monte Colombo (RN) - Italy

Phone +390541863055  |  Fax +390541863048

E-mail: info@piciesse.it

VAT: IT 02275950406

R.E.A. RN N.254851